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DBT1000 | DBT-1200 | ||||
Speci? cations: Die size: from 300x300μm Thickness: from 3 mil and up 2 basic con? gurations: ? Modul I : XYZ and Theta for Chip handling ? Modul II : XYZ， hi resolution， for multi chuck Shuttle and pin Test centering Z motion with adjustable angle Pickup Tool offset to Crosshair: programmable Test Pin to crosshair: programmable Joystick: proportionnal speed Chip hold on chuck by vacuum Two LCD display， used for wafer handling and for Test Monitoring. Video Target generator for alignment. Lights: Direct and pen LED lights. | Speci?cations: Die size: from 250x250μm (10mil) Thickness: from 75μm， (3 mil) and up 2 basic con? gurations: ? Modul I : XYZ and Theta for Chip handling， ? Modul II : XYZ， hi resolution， for multi chuck Shuttle and pin Test centering Z motion with adjustable angle Pickup Tool offset to Crosshair: programmable Test Pin to crosshair: programmable Joystick: proportionnal speed Chip hold on chuck by vacuum Two LCD display， used for wafer handling and for Test Monitoring. Video Target generator for alignment. Lights: Direct and pen LED lights. Facilities: Power: 100-240vac | ||||
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