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高純銀：99.999% Ag-5N-F-29

    檢測雜質(zhì)：Al, Au, Bi, Cd, Cu, Fe, Mg, Ni, Pb, Sb, Sn, Zn

    雜質(zhì)總含量：≤10ppm

     高純銀：99.9999% Ag-6N-F-30

     檢測雜質(zhì)：Au, Bi, Cu, Fe, Mg, Ni, Pb, Sn, Zn

     雜質(zhì)總含量：≤1ppm

用途：主要用于制備高純半導(dǎo)體合金、電子管、晶體管焊接材料、精密儀表接點材料及原子反應(yīng)堆控制棒等。

包裝：聚乙烯塑料瓶包裝外套雙層復(fù)合膜真空封裝或玻璃管真空封裝。

Specification:

 High purity Ag: 99.999% Ag-5N-F-29

 Testing impurity: Al, Au, Bi, Cd, Cu, Fe, Mg, Ni,Pb, Sb, Sn, Zn

Total impurity content: ≤10ppm

 High purity Ag: 99.9999% Ag-6N-F-30

 Testing impurity: Au, Bi, Cu, Fe, Mg, Ni, Pb, Sn,Zn

Total impurity content: ≤1ppm

Application: Usedfor the preparation of high purity semiconductor alloy, electron tubes,transistor welding material, precision meter contact material, and control rodof atomic reactor etc.

Package: Packedwith polythene plastic bottle, and double poly-film with vacuum encapsulation.Packed with glass tube with vacuum encapsulation directly.